products details

صفحه اصلی محصولات

HDI PCB PCB Prototype Mass Production Minimum Line Space 0.075mm High Density Interconnect Circuit Board Services

MOQ:	1 پنل
قیمت:	قابل مذاکره
Payment Terms:	T/T

Detail Information

توضیحات محصول

Detail Information

Place of Origin:

China

گواهی:

ISO9001, ISO13485,TS16949

نوع محصول:

8 لایه PCB HDI

مواد:

FR4 High TG S1000-2M

ضخامت مس:

1 اونس

ماسک لحیم کاری:

ماسک لحیم سیاه

نوع سرویس:

نمونه اولیه PCB/ تولید جرم

تست کردن:

تست AOI

کنترل امپدانس:

10 ±

حداقل پل ماسک لحیم کاری:

0.08 میلی متر

جزئیات بسته بندی:

پکیج Vacumm

برجسته کردن:

HDI PCB prototype services,high density interconnect circuit board,PCB mass production 0.075mm

high density interconnect circuit board

PCB mass production 0.075mm

توضیحات محصول

Product Description:

Product type	8 layer HDI printed circuit board
Material	FR4 High TG 1.6mm
Copper thickness	1/H/H/H/H/H/H/1 oz
Surface finish	EING
Technology	Blind holes and resin plugging
Soldermask	Black
Line width/space	0.1mm

Why Blind Via hole in HDI PCB

Microvias and stacked microvias can be desinged in High Density Interconnect circuit boards, also known as HDI PCBs, to enable complex interconnections in advanced designs.

Microvias, stacked microvias and via-in-pad design allow miniaturization for higher functionality in less space and can accommodate large pin-count chips such as the ones used in cell phones and tablets. Microvias will help reduce layer count in printed circuit board designs while enabling higher routing density and eliminating the need for through vias.

Consumers' growing demand for more functionality in compact and portable electronic devices—including PDAs, mobile phones, and AI products—is pushing the industry toward smaller feature sizes, finer process geometries, and more compact printed circuit boards. For engineers addressing these evolving requirements, the adoption of high-density interconnect (HDI) technology has become essential.

HDI PCB technology enables the production of circuit boards with through-hole, blind, or buried vias without relying on conventional mechanical drilling methods. To successfully implement HDI, users must not only evaluate and apply this next-generation technology, but also understand its limitations in areas such as layer stack-up design, via and microvia formation, achievable feature sizes, and the key distinctions between HDI and conventional printed circuit board technologies.

برچسب ها:

برد PCB انعطاف پذیر

PCB صلب

PCB مس

PCB انعطاف پذیر سفت و سخت

برد PCB آلومینیومی

PCB HDI

PCB مس سنگین

راجرز پی سی بی

برد PCB LED

مونتاژ PCB برق

سیم پیچ PCB

PCB چرخش سریع

PCB فرکانس بالا

مونتاژ PCB EMS

برد PCB انعطاف پذیر

PCB صلب

PCB مس

PCB انعطاف پذیر سفت و سخت

برد PCB آلومینیومی

PCB HDI

PCB مس سنگین

راجرز پی سی بی

برد PCB LED

مونتاژ PCB برق

سیم پیچ PCB

PCB چرخش سریع

PCB فرکانس بالا

مونتاژ PCB EMS

products details

HDI PCB PCB Prototype Mass Production Minimum Line Space 0.075mm High Density Interconnect Circuit Board Services

HDI PCB PCB Prototype Mass Production Minimum Line Space 0.075mm High Density Interconnect Circuit Board Services

HDI PCB prototype services,high density interconnect circuit board,PCB mass production 0.075mm

high density interconnect circuit board

PCB mass production 0.075mm

Product Description:

Why Blind Via hole in HDI PCB